Dr David Allen

PhD B.Eng (Hons)

  • Research Interests
  • Publications
  • Research Supervision
  • Using infrasonic to detect deleterious blade oscillations in wind turbines
  • 3D micro Raman spectroscopy using multi wavelength lasers
  • Use of graphene as a TBC on turbine blades


  • Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro Raman spectroscopy and white beam X-ray topography, Nucl. Instrum. Meth. B, 2010, (268, 3, 383)
  • Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam x-ray topography, Nucl. Instrum. Meth. B, 2010, (268, 3, 399)
  • X-ray diffraction imaging of dislocation generation related to microcracks in Si wafers, Powder Diffr. 2010, (25, 2, 99)
  • Dislocation sources and slip band nucleation from indents on silicon wafers, J. Appl. Cryst. 2010, (43, 1036)
  • Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers, Microelectron. Eng. 2011, (88, 64)
  • Dislocation Dynamics and slip band formation in silicon: In-situ study by X-ray diffraction imaging, J. Cryst. Growth, 2011 (318, 1, 1157)
  • Three Dimensional X-ray diffraction imaging of process-induced dislocation loops in Silicon, J. Appl. Cryst. 2011, (44, 3, 526)
  • Thermal Slip Sources at the Extremity and Bevel Edge of Silicon Wafers, J. Appl. Cryst. 2011, (44, 3, 489)
  • Nanoindentation Induced Silicon Fracture and 3D Modelling, Anales de Mecánica de la Fractura, 2010, (2, 27, 559)
  • Real time X-ray diffraction imaging for semiconductor wafer metrology and high temperature in-situ experiments, Phys. Status Solidi A, 2011, (11, 208, 2499)
  • Three dimensional X-ray Diffraction Imaging Study of Damage to Silicon Wafers, 2010, ANKA User Highlights and Annual Report
  • Influence of mechanical defects on the crystal lattice of silicon, Cryst. Res. Technol., 2011, (47, 3, 253)
  • Prediction of the Propagation Probability of Individual Cracks in Brittle Single Crystal Materials, App. Phys. Lett., 2012, (101,4,041903)
  • Crack Propogation and fracture in silicon wafers, J. Appl.Cryst., 2013, (46,4)
  • A novel x-Ray Diffraction Technique for Analysis of Die Stress Inside Fully Encapsulated Packages Chips, Electronic System-Integration Technology Conference, 17-20 Sept. 2012, pp. 1-6


  • Three Dimensional X-ray Diffraction Imaging of Slip Bands in Silicon, (E-MRS 2011) Nice, France, 9-13 May 2011
  • Three Dimensional X-ray Diffraction Imaging Study of Damage to Silicon Wafers, (3rd ANKS/KNMF Joint Users Meeting) Karlsruhe, Germany, 13-14 Oct. 2011 (Invited Talk

Previous Research Projects

  • SiDAM – a European sponsored project to study Silicon wafer damage and to create a predictive tool that can be used in industry to identify wafers that are likely to break in  manufacturing processes
  • SmartPM – a collaboration project with industries across Europe to look at producing energy saving components for both the industrial and commercial/home sector